1 Market Overview

1.1 Product Overview and Scope of Thin Wafers Temporary Bonding Equipment and Materials

1.2 Classification of Thin Wafers Temporary Bonding Equipment and Materials by Type

1.2.1 Overview: Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type: 2017 Versus 2021 Versus 2028

1.2.2 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type in 2021

1.2.3 Chemical Debonding

1.2.4 Hot Sliding Debonding

1.2.5 Mechanical Debonding

1.2.6 Laser Debonding

1.3 Global Thin Wafers Temporary Bonding Equipment and Materials Market by Application

1.3.1 Overview: Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application: 2017 Versus 2021 Versus 2028

1.3.2 < 100 µm Wafers

1.3.3 below 40µm Wafers

1.4 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size & Forecast

1.5 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast by Region

1.5.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region: 2017 VS 2021 VS 2028

1.5.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region, (2017-2022)

1.5.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size and Prospect (2017-2028)

1.5.4 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size and Prospect (2017-2028)

1.5.5 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size and Prospect (2017-2028)

1.5.6 South America Thin Wafers Temporary Bonding Equipment and Materials Market Size and Prospect (2017-2028)

1.5.7 Middle East and Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size and Prospect (2017-2028)

1.6 Market Drivers, Restraints and Trends

1.6.1 Thin Wafers Temporary Bonding Equipment and Materials Market Drivers

1.6.2 Thin Wafers Temporary Bonding Equipment and Materials Market Restraints

1.6.3 Thin Wafers Temporary Bonding Equipment and Materials Trends Analysis

2 Company Profiles

2.1 3M

2.1.1 3M Details

2.1.2 3M Major Business

2.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.1.4 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.1.5 3M Recent Developments and Future Plans

2.2 ABB

2.2.1 ABB Details

2.2.2 ABB Major Business

2.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.2.4 ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.2.5 ABB Recent Developments and Future Plans

2.3 Accretech

2.3.1 Accretech Details

2.3.2 Accretech Major Business

2.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.3.4 Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.3.5 Accretech Recent Developments and Future Plans

2.4 AGC

2.4.1 AGC Details

2.4.2 AGC Major Business

2.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.4.4 AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.4.5 AGC Recent Developments and Future Plans

2.5 AMD

2.5.1 AMD Details

2.5.2 AMD Major Business

2.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.5.4 AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.5.5 AMD Recent Developments and Future Plans

2.6 Cabot

2.6.1 Cabot Details

2.6.2 Cabot Major Business

2.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.6.4 Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.6.5 Cabot Recent Developments and Future Plans

2.7 Corning

2.7.1 Corning Details

2.7.2 Corning Major Business

2.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.7.4 Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.7.5 Corning Recent Developments and Future Plans

2.8 Crystal Solar

2.8.1 Crystal Solar Details

2.8.2 Crystal Solar Major Business

2.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.8.4 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.8.5 Crystal Solar Recent Developments and Future Plans

2.9 Dalsa

2.9.1 Dalsa Details

2.9.2 Dalsa Major Business

2.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.9.4 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.9.5 Dalsa Recent Developments and Future Plans

2.10 DoubleCheck Semiconductors

2.10.1 DoubleCheck Semiconductors Details

2.10.2 DoubleCheck Semiconductors Major Business

2.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.10.4 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.10.5 DoubleCheck Semiconductors Recent Developments and Future Plans

2.11 1366 Technologies

2.11.1 1366 Technologies Details

2.11.2 1366 Technologies Major Business

2.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.11.4 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.11.5 1366 Technologies Recent Developments and Future Plans

2.12 Ebara

2.12.1 Ebara Details

2.12.2 Ebara Major Business

2.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.12.4 Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.12.5 Ebara Recent Developments and Future Plans

2.13 ERS

2.13.1 ERS Details

2.13.2 ERS Major Business

2.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.13.4 ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.13.5 ERS Recent Developments and Future Plans

2.14 Hamamatsu

2.14.1 Hamamatsu Details

2.14.2 Hamamatsu Major Business

2.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.14.4 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.14.5 Hamamatsu Recent Developments and Future Plans

2.15 IBM

2.15.1 IBM Details

2.15.2 IBM Major Business

2.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.15.4 IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.15.5 IBM Recent Developments and Future Plans

2.16 Intel

2.16.1 Intel Details

2.16.2 Intel Major Business

2.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.16.4 Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.16.5 Intel Recent Developments and Future Plans

2.17 LG Innotek

2.17.1 LG Innotek Details

2.17.2 LG Innotek Major Business

2.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.17.4 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.17.5 LG Innotek Recent Developments and Future Plans

2.18 Mitsubishi Electric

2.18.1 Mitsubishi Electric Details

2.18.2 Mitsubishi Electric Major Business

2.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.18.4 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.18.5 Mitsubishi Electric Recent Developments and Future Plans

2.19 Qualcomm

2.19.1 Qualcomm Details

2.19.2 Qualcomm Major Business

2.19.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.19.4 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.19.5 Qualcomm Recent Developments and Future Plans

2.20 Robert Bosch

2.20.1 Robert Bosch Details

2.20.2 Robert Bosch Major Business

2.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.20.4 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.20.5 Robert Bosch Recent Developments and Future Plans

2.21 Samsung

2.21.1 Samsung Details

2.21.2 Samsung Major Business

2.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.21.4 Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.21.5 Samsung Recent Developments and Future Plans

2.22 Sumitomo Chemical

2.22.1 Sumitomo Chemical Details

2.22.2 Sumitomo Chemical Major Business

2.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

2.22.4 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)

2.22.5 Sumitomo Chemical Recent Developments and Future Plans

3 Market Competition, by Players

3.1 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue and Share by Players (2019, 2020, 2021, and 2022)

3.2 Market Concentration Rate

3.2.1 Top 3 Thin Wafers Temporary Bonding Equipment and Materials Players Market Share in 2021

3.2.2 Top 10 Thin Wafers Temporary Bonding Equipment and Materials Players Market Share in 2021

3.2.3 Market Competition Trend

3.3 Thin Wafers Temporary Bonding Equipment and Materials Players Head Office, Products and Services Provided

3.4 Thin Wafers Temporary Bonding Equipment and Materials Mergers & Acquisitions

3.5 Thin Wafers Temporary Bonding Equipment and Materials New Entrants and Expansion Plans

4 Market Size Segment by Type

4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue and Market Share by Type (2017-2022)

4.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Forecast by Type (2023-2028)

5 Market Size Segment by Application

5.1 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Application (2017-2022)

5.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Forecast by Application (2023-2028)

6 North America by Country, by Type, and by Application

6.1 North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2028)

6.2 North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2028)

6.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country

6.3.1 North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2028)

6.3.2 United States Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

6.3.3 Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

6.3.4 Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

7 Europe by Country, by Type, and by Application

7.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2028)

7.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2028)

7.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country

7.3.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2028)

7.3.2 Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

7.3.3 France Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

7.3.4 United Kingdom Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

7.3.5 Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

7.3.6 Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

8 Asia-Pacific by Region, by Type, and by Application

8.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2028)

8.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2028)

8.3 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region

8.3.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Region (2017-2028)

8.3.2 China Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

8.3.3 Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

8.3.4 South Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

8.3.5 India Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

8.3.6 Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

8.3.7 Australia Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

9 South America by Country, by Type, and by Application

9.1 South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2028)

9.2 South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2028)

9.3 South America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country

9.3.1 South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2028)

9.3.2 Brazil Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

9.3.3 Argentina Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

10 Middle East & Africa by Country, by Type, and by Application

10.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2028)

10.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2028)

10.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country

10.3.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2028)

10.3.2 Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

10.3.3 Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

10.3.4 UAE Thin Wafers Temporary Bonding Equipment and Materials Market Size and Forecast (2017-2028)

11 Research Findings and Conclusion

12 Appendix

12.1 Methodology

12.2 Research Process and Data Source

12.3 Disclaimer

List of Tables

Table 1. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type, (USD Million), 2017 VS 2021 VS 2028

Table 2. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application, (USD Million), 2017 VS 2021 VS 2028

Table 3. Global Market Thin Wafers Temporary Bonding Equipment and Materials Revenue (Million USD) Comparison by Region (2017 VS 2021 VS 2028)

Table 4. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) by Region (2017-2022)

Table 5. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Region (2023-2028)

Table 6. 3M Corporate Information, Head Office, and Major Competitors

Table 7. 3M Major Business

Table 8. 3M Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 9. 3M Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 10. ABB Corporate Information, Head Office, and Major Competitors

Table 11. ABB Major Business

Table 12. ABB Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 13. ABB Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 14. Accretech Corporate Information, Head Office, and Major Competitors

Table 15. Accretech Major Business

Table 16. Accretech Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 17. Accretech Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 18. AGC Corporate Information, Head Office, and Major Competitors

Table 19. AGC Major Business

Table 20. AGC Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 21. AGC Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 22. AMD Corporate Information, Head Office, and Major Competitors

Table 23. AMD Major Business

Table 24. AMD Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 25. AMD Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 26. Cabot Corporate Information, Head Office, and Major Competitors

Table 27. Cabot Major Business

Table 28. Cabot Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 29. Cabot Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 30. Corning Corporate Information, Head Office, and Major Competitors

Table 31. Corning Major Business

Table 32. Corning Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 33. Corning Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 34. Crystal Solar Corporate Information, Head Office, and Major Competitors

Table 35. Crystal Solar Major Business

Table 36. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 37. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 38. Dalsa Corporate Information, Head Office, and Major Competitors

Table 39. Dalsa Major Business

Table 40. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 41. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 42. DoubleCheck Semiconductors Corporate Information, Head Office, and Major Competitors

Table 43. DoubleCheck Semiconductors Major Business

Table 44. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 45. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 46. 1366 Technologies Corporate Information, Head Office, and Major Competitors

Table 47. 1366 Technologies Major Business

Table 48. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 49. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 50. Ebara Corporate Information, Head Office, and Major Competitors

Table 51. Ebara Major Business

Table 52. Ebara Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 53. Ebara Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 54. ERS Corporate Information, Head Office, and Major Competitors

Table 55. ERS Major Business

Table 56. ERS Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 57. ERS Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 58. Hamamatsu Corporate Information, Head Office, and Major Competitors

Table 59. Hamamatsu Major Business

Table 60. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 61. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 62. IBM Corporate Information, Head Office, and Major Competitors

Table 63. IBM Major Business

Table 64. IBM Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 65. IBM Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 66. Intel Corporate Information, Head Office, and Major Competitors

Table 67. Intel Major Business

Table 68. Intel Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 69. Intel Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 70. LG Innotek Corporate Information, Head Office, and Major Competitors

Table 71. LG Innotek Major Business

Table 72. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 73. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 74. Mitsubishi Electric Corporate Information, Head Office, and Major Competitors

Table 75. Mitsubishi Electric Major Business

Table 76. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 77. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 78. Qualcomm Corporate Information, Head Office, and Major Competitors

Table 79. Qualcomm Major Business

Table 80. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 81. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 82. Robert Bosch Corporate Information, Head Office, and Major Competitors

Table 83. Robert Bosch Major Business

Table 84. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 85. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 86. Samsung Corporate Information, Head Office, and Major Competitors

Table 87. Samsung Major Business

Table 88. Samsung Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 89. Samsung Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 90. Sumitomo Chemical Corporate Information, Head Office, and Major Competitors

Table 91. Sumitomo Chemical Major Business

Table 92. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Product and Solutions

Table 93. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)

Table 94. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) by Players (2019, 2020, 2021, and 2022)

Table 95. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Players (2019, 2020, 2021, and 2022)

Table 96. Breakdown of Thin Wafers Temporary Bonding Equipment and Materials by Company Type (Tier 1, Tier 2 and Tier 3)

Table 97. Thin Wafers Temporary Bonding Equipment and Materials Players Head Office, Products and Services Provided

Table 98. Thin Wafers Temporary Bonding Equipment and Materials Mergers & Acquisitions in the Past Five Years

Table 99. Thin Wafers Temporary Bonding Equipment and Materials New Entrants and Expansion Plans

Table 100. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) by Type (2017-2022)

Table 101. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Type (2017-2022)

Table 102. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Forecast by Type (2023-2028)

Table 103. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2022)

Table 104. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Forecast by Application (2023-2028)

Table 105. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2022) & (USD Million)

Table 106. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2023-2028) & (USD Million)

Table 107. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2022) & (USD Million)

Table 108. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2023-2028) & (USD Million)

Table 109. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2022) & (USD Million)

Table 110. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2023-2028) & (USD Million)

Table 111. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2022) & (USD Million)

Table 112. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2023-2028) & (USD Million)

Table 113. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2022) & (USD Million)

Table 114. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2023-2028) & (USD Million)

Table 115. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2022) & (USD Million)

Table 116. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2023-2028) & (USD Million)

Table 117. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2022) & (USD Million)

Table 118. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2023-2028) & (USD Million)

Table 119. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2022) & (USD Million)

Table 120. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2023-2028) & (USD Million)

Table 121. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Region (2017-2022) & (USD Million)

Table 122. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue by Region (2023-2028) & (USD Million)

Table 123. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2022) & (USD Million)

Table 124. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2023-2028) & (USD Million)

Table 125. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2022) & (USD Million)

Table 126. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2023-2028) & (USD Million)

Table 127. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2022) & (USD Million)

Table 128. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2023-2028) & (USD Million)

Table 129. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2017-2022) & (USD Million)

Table 130. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Type (2023-2028) & (USD Million)

Table 131. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2017-2022) & (USD Million)

Table 132. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Application (2023-2028) & (USD Million)

Table 133. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2017-2022) & (USD Million)

Table 134. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue by Country (2023-2028) & (USD Million)

List of Figures

Figure 1. Thin Wafers Temporary Bonding Equipment and Materials Picture

Figure 2. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type in 2021

Figure 3. Chemical Debonding

Figure 4. Hot Sliding Debonding

Figure 5. Mechanical Debonding

Figure 6. Laser Debonding

Figure 7. Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Application in 2021

Figure 8. < 100 µm Wafers Picture

Figure 9. below 40µm Wafers Picture

Figure 10. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, (USD Million): 2017 VS 2021 VS 2028

Figure 11. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue and Forecast (2017-2028) & (USD Million)

Figure 12. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Region (2017-2028)

Figure 13. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Region in 2021

Figure 14. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) and Growth Rate (2017-2028)

Figure 15. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) and Growth Rate (2017-2028)

Figure 16. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) and Growth Rate (2017-2028)

Figure 17. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) and Growth Rate (2017-2028)

Figure 18. Middle East and Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue (USD Million) and Growth Rate (2017-2028)

Figure 19. Thin Wafers Temporary Bonding Equipment and Materials Market Drivers

Figure 20. Thin Wafers Temporary Bonding Equipment and Materials Market Restraints

Figure 21. Thin Wafers Temporary Bonding Equipment and Materials Market Trends

Figure 22. 3M Recent Developments and Future Plans

Figure 23. ABB Recent Developments and Future Plans

Figure 24. Accretech Recent Developments and Future Plans

Figure 25. AGC Recent Developments and Future Plans

Figure 26. AMD Recent Developments and Future Plans

Figure 27. Cabot Recent Developments and Future Plans

Figure 28. Corning Recent Developments and Future Plans

Figure 29. Crystal Solar Recent Developments and Future Plans

Figure 30. Dalsa Recent Developments and Future Plans

Figure 31. DoubleCheck Semiconductors Recent Developments and Future Plans

Figure 32. 1366 Technologies Recent Developments and Future Plans

Figure 33. Ebara Recent Developments and Future Plans

Figure 34. ERS Recent Developments and Future Plans

Figure 35. Hamamatsu Recent Developments and Future Plans

Figure 36. IBM Recent Developments and Future Plans

Figure 37. Intel Recent Developments and Future Plans

Figure 38. LG Innotek Recent Developments and Future Plans

Figure 39. Mitsubishi Electric Recent Developments and Future Plans

Figure 40. Qualcomm Recent Developments and Future Plans

Figure 41. Robert Bosch Recent Developments and Future Plans

Figure 42. Samsung Recent Developments and Future Plans

Figure 43. Sumitomo Chemical Recent Developments and Future Plans

Figure 44. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Players in 2021

Figure 45. Thin Wafers Temporary Bonding Equipment and Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3) in 2021

Figure 46. Global Top 3 Players Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share in 2021

Figure 47. Global Top 10 Players Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share in 2021

Figure 48. Key Players Market Share Trend (Top 3 Market Share: 2020 VS 2021 VS 2022)

Figure 49. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Type in 2021

Figure 50. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share Forecast by Type (2023-2028)

Figure 51. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Share by Application in 2021

Figure 52. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share Forecast by Application (2023-2028)

Figure 53. North America Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Type (2017-2028)

Figure 54. North America Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Application (2017-2028)

Figure 55. North America Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Country (2017-2028)

Figure 56. United States Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 57. Canada Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 58. Mexico Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 59. Europe Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Type (2017-2028)

Figure 60. Europe Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Application (2017-2028)

Figure 61. Europe Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Country (2017-2028)

Figure 62. Germany Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 63. France Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 64. United Kingdom Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 65. Russia Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 66. Italy Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 67. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Type (2017-2028)

Figure 68. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Application (2017-2028)

Figure 69. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Region (2017-2028)

Figure 70. China Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 71. Japan Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 72. South Korea Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 73. India Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 74. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 75. Australia Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 76. South America Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Type (2017-2028)

Figure 77. South America Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Application (2017-2028)

Figure 78. South America Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Country (2017-2028)

Figure 79. Brazil Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 80. Argentina Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 81. Middle East and Africa Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Type (2017-2028)

Figure 82. Middle East and Africa Thin Wafers Temporary Bonding Equipment and Materials Sales Market Share by Application (2017-2028)

Figure 83. Middle East and Africa Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Country (2017-2028)

Figure 84. Turkey Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 85. Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 86. UAE Thin Wafers Temporary Bonding Equipment and Materials Revenue and Growth Rate (2017-2028) & (USD Million)

Figure 87. Methodology

Figure 88. Research Process and Data Source