In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
Scope of the Report:This report focuses on the 3D IC and 2.5D IC in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
The worldwide market for 3D IC and 2.5D IC is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2025, from xx million US$ in 2020, according to a new study.
Market Segment by Manufacturers, this report covers TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)
Market Segment by Regions, regional analysis covers North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers 3D wafer-level chip-scale packaging
3D TSV
2.5D
Market Segment by Applications, can be divided into Consumer electronics
Telecommunication
Industry sector
Automotive
Military and Aerospace
Smart technologies
Medical devices
There are 15 Chapters to deeply display the global 3D IC and 2.5D IC market.
Chapter 1, to describe 3D IC and 2.5D IC Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of 3D IC and 2.5D IC, with sales, revenue, and price of 3D IC and 2.5D IC, in 2018 and 2019;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2018 and 2019;
Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D IC and 2.5D IC, for each region, from 2015 to 2020;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2015 to 2020;
Chapter 12, 3D IC and 2.5D IC market forecast, by regions, type and application, with sales and revenue, from 2020 to 2025;
Chapter 13, 14 and 15, to describe 3D IC and 2.5D IC sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source
Frequently Asked Questions
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
- By Type
- By Application
- By Region
- By Country
- By Manufacturer
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
