Electronic devices are available in a variety of package types and include semiconductors (integrated circuits), magnets, capacitors, and resistors.
Scope of the Report:This report focuses on the Advanced Semiconductor Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The semiconductor packaging services market has drawn the greatest attention in the investment community.
The Semiconductor packaging industry is expected to achieve a CAGR of 10% over the next three to five years. This trend is not only driven by the increasing market demand for packaging of components for various new semiconductor applications in the fields of radio, Internet and consumer products, but also external packaging assembly by semiconductor device manufacturers (SDM). Driven by the growth of test runs.
The worldwide market for Advanced Semiconductor Packaging is expected to grow at a CAGR of roughly 13.2% over the next five years, will reach 46600 million US$ in 2023, from 22200 million US$ in 2017, according to a new study.
Market Segment by Manufacturers, this report covers AMD
Intel Corp
Amkor Technology
STMicroelectronics
Hitachi Chemical
Infineon
Avery Dennison
Sumitomo Chemical
ASE Group
Kyocera
Market Segment by Regions, regional analysis covers North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Market Segment by Applications, can be divided into Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other End Users
There are 15 Chapters to deeply display the global Advanced Semiconductor Packaging market.
Chapter 1, to describe Advanced Semiconductor Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Advanced Semiconductor Packaging, with sales, revenue, and price of Advanced Semiconductor Packaging, in 2018 and 2019;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2018 and 2019;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Advanced Semiconductor Packaging, for each region, from 2015 to 2020;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2015 to 2020;
Chapter 12, Advanced Semiconductor Packaging market forecast, by regions, type and application, with sales and revenue, from 2020 to 2025;
Chapter 13, 14 and 15, to describe Advanced Semiconductor Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source
Frequently Asked Questions
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
- By Type
- By Application
- By Region
- By Country
- By Manufacturer
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
