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Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder ...
Dual-side Aligners are used in MEMS, wafer bumping, chip scale packaging as well as applications in compound semiconductors, power devices and photovoltaic.Scope of the Report:The worldwide market for Dual-side Aligners ...
Power over Ethernet (PoE) transfers DC current through the standard Ethernet cables, including CAT5, CAT5e, and CAT6 cables.Scope of the Report:This report focuses on the PoE Chipset in global market, especially in North...
Product lifecycle management (PLM) software is used in several lifecycle stages of product development.Scope of the Report:This report focuses on the PLM in Electrical and Electronics in global market, especially in Nort...
Smart plugs transform ordinary appliances into smart appliances.Scope of the Report:This report focuses on the Smart Plug in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East...
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